JPH0442746U - - Google Patents
Info
- Publication number
- JPH0442746U JPH0442746U JP8430690U JP8430690U JPH0442746U JP H0442746 U JPH0442746 U JP H0442746U JP 8430690 U JP8430690 U JP 8430690U JP 8430690 U JP8430690 U JP 8430690U JP H0442746 U JPH0442746 U JP H0442746U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- cooling fin
- package
- positioning means
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims 8
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8430690U JPH0442746U (en]) | 1990-08-08 | 1990-08-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8430690U JPH0442746U (en]) | 1990-08-08 | 1990-08-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0442746U true JPH0442746U (en]) | 1992-04-10 |
Family
ID=31632686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8430690U Pending JPH0442746U (en]) | 1990-08-08 | 1990-08-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0442746U (en]) |
-
1990
- 1990-08-08 JP JP8430690U patent/JPH0442746U/ja active Pending
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